Integrated FanOut is a new generation packaging technology for chipsets developed by TSMC. It’s designed to increase system bandwidth in conjunction with being easily scalable: it will reduce power consumption and results in thinner processors as it removes substrate from the design. Thinner chipsets result in greater thermal efficiency, because heat is quicker to dissipate. The shorter the distance between internal processor components can also result in greater performance. The TSMC InFO...
TMSC's INFO is the new technology for the hardware manufacturers.
TMSC's INFO is the new technology for the hardware manufacturers.